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Analysis of high resistive conduction mechanism in HfO2-based ReRAM devices

  • Silvana Guitarra*
  • , Lionel Trojman
  • , Laurent Raymond
  • *Corresponding author for this work
  • ISEP
  • Aix-Marseille Université

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper investigates the conduction mechanism in HfO2-based ReRAM devices during the High Resistance State (HRS). Our approach involves analyzing the experimental response of devices with different areas. Two parameters associated with the conduction mechanism are identified. Further, after the fitting, we can quantify the variability in the electrical response by using the relative standard deviation (RSD). Finally, an expression of the current state of HRS is proposed. It is consistent with the Quantum Point Contact Model (QPC) principles, furnishing a robust theoretical foundation elucidating the observed behavior. This work contributes to a deeper understanding of ReRAM operational dynamics during the HRS, bridging experimental insights with theoretical models.

Original languageEnglish
Title of host publication2024 IEEE Latin American Electron Devices Conference, LAEDC 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350361292
DOIs
StatePublished - 2024
Event2024 IEEE Latin American Electron Devices Conference, LAEDC 2024 - Guatemala City, Guatemala
Duration: 8 May 202410 May 2024

Publication series

Name2024 IEEE Latin American Electron Devices Conference, LAEDC 2024

Conference

Conference2024 IEEE Latin American Electron Devices Conference, LAEDC 2024
Country/TerritoryGuatemala
CityGuatemala City
Period8/05/2410/05/24

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • HRS
  • QPC
  • ReRAM
  • conduction mechanism
  • filament
  • variability

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