TY - GEN
T1 - Design of N-port Radial Dividers in Substrate Integrated Waveguided Technology
AU - Haro-Baez, Raul
AU - Calvache-Espin, Mauricio F.
AU - Benitez, Diego S.
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/10/13
Y1 - 2020/10/13
N2 - Modern microwave and millimeter-wave systems require high quality and high-density integration circuits. Also, two of the most critical requirements of these systems are reduced size and cost. The implementation of combining technologies systems seeks to provide better performance in terms of efficiency, size, and price. In this sense, this paper focuses on the analysis, design, and implementation of N- ports radial dividers in the Ku band using Substrate Integrated Waveguide (SIW) technology, bringing together the advantages of radial dividers and the high efficiency of SIW technology. The design and analysis of three power dividers (one 10-port and two 8-port) are presented in SIW technology with transitions in microstrip, using two different substrates. Both simulation and experimental results show good performance agreement.
AB - Modern microwave and millimeter-wave systems require high quality and high-density integration circuits. Also, two of the most critical requirements of these systems are reduced size and cost. The implementation of combining technologies systems seeks to provide better performance in terms of efficiency, size, and price. In this sense, this paper focuses on the analysis, design, and implementation of N- ports radial dividers in the Ku band using Substrate Integrated Waveguide (SIW) technology, bringing together the advantages of radial dividers and the high efficiency of SIW technology. The design and analysis of three power dividers (one 10-port and two 8-port) are presented in SIW technology with transitions in microstrip, using two different substrates. Both simulation and experimental results show good performance agreement.
KW - Computer simulation technology
KW - Power divider
KW - Radial divider
KW - SIW
KW - Substrate integrated waveguide
UR - https://www.scopus.com/pages/publications/85098573155
U2 - 10.1109/ANDESCON50619.2020.9272135
DO - 10.1109/ANDESCON50619.2020.9272135
M3 - Contribución a la conferencia
AN - SCOPUS:85098573155
T3 - 2020 IEEE ANDESCON, ANDESCON 2020
BT - 2020 IEEE ANDESCON, ANDESCON 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE ANDESCON, ANDESCON 2020
Y2 - 13 October 2020 through 16 October 2020
ER -