TY - GEN
T1 - On the 3D Finite Element Modeling of the Fingertip Compression during the Use of Touch Screens
AU - Loza, Malena
AU - Benitez, Diego S.
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/11
Y1 - 2019/11
N2 - Finite element (FE) analysis has become an important instrument that engineers and ergonomic designers use to develop handle tools with the aim to reduce fatigue and improve comfort for the operators. The inadequate use of tools, in this case, a touch screen, may lead to many occupational-related disorders in the hand and arm. This paper shows a 3D FE modeling of a fingertip which is composed of bone, soft-tissue, dermis, epidermis and nail. The model was built using linearly elastic mechanical characteristics for all the components. The fingertip is in contact with a touch screen represented by a layer of glass. Stresses produced over the layers of the skin are reported at different inclination angles as well as deformations produced by the contact between the fingertip and the screen.
AB - Finite element (FE) analysis has become an important instrument that engineers and ergonomic designers use to develop handle tools with the aim to reduce fatigue and improve comfort for the operators. The inadequate use of tools, in this case, a touch screen, may lead to many occupational-related disorders in the hand and arm. This paper shows a 3D FE modeling of a fingertip which is composed of bone, soft-tissue, dermis, epidermis and nail. The model was built using linearly elastic mechanical characteristics for all the components. The fingertip is in contact with a touch screen represented by a layer of glass. Stresses produced over the layers of the skin are reported at different inclination angles as well as deformations produced by the contact between the fingertip and the screen.
KW - Finite Element Modeling
KW - fingertip
KW - touch screen
UR - https://www.scopus.com/pages/publications/85081064388
U2 - 10.1109/CHILECON47746.2019.8987458
DO - 10.1109/CHILECON47746.2019.8987458
M3 - Contribución a la conferencia
AN - SCOPUS:85081064388
T3 - IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2019
BT - IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2019
Y2 - 13 November 2019 through 27 November 2019
ER -