Abstract
In this work the variation of the FDSOI-UTTB p-MOS mobility is studied for different biases of the buried oxide. Two dielectrics are considered: HfO2 (high-k) with 8A-EOT and a SiON reference. The substrate biases (through the buried oxide) enables a mobility of about 150 cm2/V.s (90% improvement) similar to the SiON reference (with back bias) and close to the results obtained for conventional high-k n-MOS. This 90% improvement is explained by a based physics model which describes a variation of the inversion charge centroid towards the buried oxide for large substrate biases.
| Original language | English |
|---|---|
| Article number | 7786299 |
| Pages (from-to) | 4235-4240 |
| Number of pages | 6 |
| Journal | IEEE Latin America Transactions |
| Volume | 14 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 2016 |
Keywords
- EOT
- FDSOI
- HfO2
- MOSFET
- RCS
- SiON
- Split-CV
- UTEOT
- UTTB
- high-k
- interface defects
- mobility
- p-MOS
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