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Study of Mobility for HfO2 dielectric FDSOI-UTTB pMOS under substrate biases

  • Lionel Trojman*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

In this work the variation of the FDSOI-UTTB p-MOS mobility is studied for different biases of the buried oxide. Two dielectrics are considered: HfO2 (high-k) with 8A-EOT and a SiON reference. The substrate biases (through the buried oxide) enables a mobility of about 150 cm2/V.s (90% improvement) similar to the SiON reference (with back bias) and close to the results obtained for conventional high-k n-MOS. This 90% improvement is explained by a based physics model which describes a variation of the inversion charge centroid towards the buried oxide for large substrate biases.

Original languageEnglish
Article number7786299
Pages (from-to)4235-4240
Number of pages6
JournalIEEE Latin America Transactions
Volume14
Issue number10
DOIs
StatePublished - Oct 2016

Keywords

  • EOT
  • FDSOI
  • HfO2
  • MOSFET
  • RCS
  • SiON
  • Split-CV
  • UTEOT
  • UTTB
  • high-k
  • interface defects
  • mobility
  • p-MOS

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