TY - GEN
T1 - Analysis of high resistive conduction mechanism in HfO2-based ReRAM devices
AU - Guitarra, Silvana
AU - Trojman, Lionel
AU - Raymond, Laurent
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper investigates the conduction mechanism in HfO2-based ReRAM devices during the High Resistance State (HRS). Our approach involves analyzing the experimental response of devices with different areas. Two parameters associated with the conduction mechanism are identified. Further, after the fitting, we can quantify the variability in the electrical response by using the relative standard deviation (RSD). Finally, an expression of the current state of HRS is proposed. It is consistent with the Quantum Point Contact Model (QPC) principles, furnishing a robust theoretical foundation elucidating the observed behavior. This work contributes to a deeper understanding of ReRAM operational dynamics during the HRS, bridging experimental insights with theoretical models.
AB - This paper investigates the conduction mechanism in HfO2-based ReRAM devices during the High Resistance State (HRS). Our approach involves analyzing the experimental response of devices with different areas. Two parameters associated with the conduction mechanism are identified. Further, after the fitting, we can quantify the variability in the electrical response by using the relative standard deviation (RSD). Finally, an expression of the current state of HRS is proposed. It is consistent with the Quantum Point Contact Model (QPC) principles, furnishing a robust theoretical foundation elucidating the observed behavior. This work contributes to a deeper understanding of ReRAM operational dynamics during the HRS, bridging experimental insights with theoretical models.
KW - HRS
KW - QPC
KW - ReRAM
KW - conduction mechanism
KW - filament
KW - variability
UR - http://www.scopus.com/inward/record.url?scp=85197454488&partnerID=8YFLogxK
U2 - 10.1109/LAEDC61552.2024.10555862
DO - 10.1109/LAEDC61552.2024.10555862
M3 - Contribución a la conferencia
AN - SCOPUS:85197454488
T3 - 2024 IEEE Latin American Electron Devices Conference, LAEDC 2024
BT - 2024 IEEE Latin American Electron Devices Conference, LAEDC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE Latin American Electron Devices Conference, LAEDC 2024
Y2 - 8 May 2024 through 10 May 2024
ER -