Resumen
In times of accelerating cycles of technology development and a busy search for innovation in products, processes, and business models, a growing hype surrounding innovation, especially technological innovation, can be determined. With many catchwords buzzing around and suggesting extraordinary value for an enterprise, the need of a careful check of the technological innovation and a profound knowledge of the benefits and costs involved is indispensable. This work presents a comparative overview of various models of technological benefit assessment and an evaluation of these models regarding their applicability in the transportation and logistics sector.
| Idioma original | Inglés |
|---|---|
| Título de la publicación alojada | Proceedings - 2018 IEEE International Conference on Smart Manufacturing, Industrial and Logistics Engineering, SMILE 2018 |
| Editores | Chen-Fu Chien, Runliang Dou, Jie-Zheng Wu |
| Editorial | Institute of Electrical and Electronics Engineers Inc. |
| Páginas | 21-26 |
| Número de páginas | 6 |
| ISBN (versión digital) | 9781538631836 |
| DOI | |
| Estado | Publicada - 3 may. 2018 |
| Evento | 2018 IEEE International Conference on Smart Manufacturing, Industrial and Logistics Engineering, SMILE 2018 - Hsinchu, Taiwán Duración: 8 feb. 2018 → 9 feb. 2018 |
Serie de la publicación
| Nombre | Proceedings - 2018 IEEE International Conference on Smart Manufacturing, Industrial and Logistics Engineering, SMILE 2018 |
|---|---|
| Volumen | 2018-January |
Conferencia
| Conferencia | 2018 IEEE International Conference on Smart Manufacturing, Industrial and Logistics Engineering, SMILE 2018 |
|---|---|
| País/Territorio | Taiwán |
| Ciudad | Hsinchu |
| Período | 8/02/18 → 9/02/18 |
ODS de las Naciones Unidas
Este resultado contribuye a los siguientes Objetivos de Desarrollo Sostenible
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ODS 9: Industria, innovación e infraestructura
Huella
Profundice en los temas de investigación de 'Comparing methods of technology benefit assessment regarding their applicability to transportation and logistics'. En conjunto forman una huella única.Citar esto
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