TY - GEN
T1 - On the Analysis of Strong Earthquake Seismic Signals Using Variational-Mode Decomposition
AU - Granda, Francisco
AU - Benitez, Diego S.
AU - Yepez, Fabricio
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/11
Y1 - 2019/11
N2 - In this paper, the use of Variational-mode decomposition (VMD) is proposed as an alternative technique for the analysis of the seismic accelerogram signals related to strong earthquake events. The proposed method was tested using several accelerogram signals recorded at different stations during the Mw 7.8 Pedernales earthquake, Ecuador in April 2016. Signal decomposition analysis allowed to create heat maps for better visualization and interpretation of the earthquake's travelling wave and the attenuation frequency phenomena. The results obtained agree with seismic studies about the Pedernales earthquake.
AB - In this paper, the use of Variational-mode decomposition (VMD) is proposed as an alternative technique for the analysis of the seismic accelerogram signals related to strong earthquake events. The proposed method was tested using several accelerogram signals recorded at different stations during the Mw 7.8 Pedernales earthquake, Ecuador in April 2016. Signal decomposition analysis allowed to create heat maps for better visualization and interpretation of the earthquake's travelling wave and the attenuation frequency phenomena. The results obtained agree with seismic studies about the Pedernales earthquake.
KW - Variational-mode decomposition (VMD)
KW - accelerogram
KW - heat maps
KW - seismic signal analysis
KW - signal decomposition
KW - visualization
UR - http://www.scopus.com/inward/record.url?scp=85081061552&partnerID=8YFLogxK
U2 - 10.1109/CHILECON47746.2019.8987561
DO - 10.1109/CHILECON47746.2019.8987561
M3 - Contribución a la conferencia
AN - SCOPUS:85081061552
T3 - IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2019
BT - IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2019
Y2 - 13 November 2019 through 27 November 2019
ER -