On the origin of the mobility reduction in bulk-Si, UTBOX-FDSOI and SiGe devices with ultrathin-EOT dielectrics

L. A. Ragnarsson, J. Mitard, T. Kauerauf, A. De Keersgieter, T. Schram, E. Rohr, N. Collaert, M. Jurczak, S. H. Hong, J. Tseng, W. E. Wang, L. Trojman, K. K. Bourdelle, B. Y. Nguyen, P. Absil, T. Y. Hoffmann

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

16 Citas (Scopus)

Resumen

The effects of ultrathin EOT on the carrier mobility in bulk-Si, UTBOX-FDSOI and SiGe-QW pFET devices were compared. The mobility is found to decrease dramatically with the EOT (Tinv) as a result of stronger charge and surface roughness scattering at thinner SiOx interface layers irrespective of the device technology. UTBOX-FDSOI and bulk-Si nFETs have identical mobility values (190 cm2/Vs) at Tinv12.5. In the UTBOX-FDSOI device architecture, a positive back gate bias provides a strong enhancement in electron mobility. In SiGe-QW pFET devices, a 150% improvement in hole-mobility is observed with low thermal budget laser-anneal (LA).

Idioma originalInglés
Título de la publicación alojadaProceedings of 2011 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2011
Páginas116-117
Número de páginas2
DOI
EstadoPublicada - 2011
Evento2011 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2011 - Hsinchu, Taiwán
Duración: 25 abr. 201127 abr. 2011

Serie de la publicación

NombreInternational Symposium on VLSI Technology, Systems, and Applications, Proceedings

Conferencia

Conferencia2011 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2011
País/TerritorioTaiwán
CiudadHsinchu
Período25/04/1127/04/11

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